PVD Systems

AJA Orion 5 – Angie

AJA Orion 5 (Angie)

© E308-01

UHV DC/RF magnetron sputtering with 3 confocal cathodes (1x3'', 2x2''), substrate heating up to 700 °C, and Ar, N2, O2 gases.

Z400 – Ylvi

Z400 (YLVI)

© E308-01

DC/RF magnetron sputtering, one 3" cathode, substrate heating to 650 °C, Ar, N2, and O2 gases.

Noreia

Noreia

© E308-01

HiPIMS system, 4 confocal cathodes (2x3'', 2x6''), substrate heating to 600 °C, Ar, N2, and O2 gases.

Frida

Frida

© E308-01

HiPIMS system, one 3" cathode, substrate heating to 650 °C, Ar, N2, O2, and C2H2 gases.

Helga

Helga

© E308-01

CAE system, one 6" cathode (with skimmershield), Ar, N2, and O2 (optional C2H2) gases.

Oerlikon Balzers Innova 1.0 – Heidi

Oerlikon Balzers Innova 1.0 – Heidi

© Dagmar Fischer

Industrial machine with 6 arc and 4 sputter sources, temperatures up to 600 °C, various gases.

Thermal Analyses

STA 449 F1 Jupiter – Daisy

STA 449 F1 Jupiter – Daisy

© E308-01

Netzsch STA 449 F1 Jupiter, combining DSC and TGA, with 2 ovens (1600 °C and 2400 °C (vacuum)).

kSA-MOS-T-Scan – Kate

kSA-MOS-T-Scan – Kate

© E308-01

Wafer curvature measurement kSA MOS (Multi-beam Optical Sensor) ThermalScan Systems (MOS-TS300-HAT; linear scan up to 300 mm, RT–1000 °C, 10 K/s, passive cooling, vacuum). 

HT-Vacuum Oven – Senta

HT-Vacuum Oven – Senta

© E308-01

Centorr LF22-2000 vacuum furnace, Mo-shielding, max. 1600 °C, Ar, N2, vacuum, heating rate 50 K/min, passive cooling.

Mechanical Characterization

UMIS2 Nanoindenter – Fedora

UMIS2 Nanoindenter – Fedora

© E308-01

CSIRO UMIS with Berkovich or Cube corner, dual force range 0–50 mN, 0–500 mN, dual displacement range 0–2 µm, 0–20 µm.

FT-I04 Femto-Indenter – Eve

FT-I04 Femto-Indenter

© E308-01

Nanoindenter with continuous stiffness measurement, 0.5 nN–200 mN, position 50 pm–20 µm (fine) or 40 mm (coarse), 130x130 mm 6 sample stage, high-speed mapping, fatigue testing.

 

FT-NMT04-XYZ in-situ SEM Femto-Nanoindenter – Wall⋅e

FT-NMT04-XYZ in-situ SEM Femto-Nanoindenter

© E308-01

Nanomechanical testing in SEM, force 0.5 nN–200 mN, position 50 pm–21 mm, compression/tensile, dynamic fracture, nanoindentation and fatigue.

Tribology and Wear

Nanovea Tribometer – Trixi

Nanovea Tribometer – Trixi

© E308-01

Disc holder 0.01–2000 rpm, sensor 20 N, weights 1, 2, 5, 10 N, liquid cup holder, heater to 900 °C sample temp. 

 

Nanovea Profilometer – Luxi

Nanovea Profilometer – Luxi

© E308-01

3D Non-Contact white light profiler, 50 mm translation, 18 mm/s, CCS Prima sensor with up to 2 kHz data acquisition.

 

Calowear

Calowear

© E308-01

Coating-thickness measurements of 0.3–30 µm (error of 1–5 %) via grinded calottes of diameter 0.1–2 mm using ball diameter 15–30 mm.

Services

Sand Blaster – Emma

Sand Blaster – Emma

© E308-01

Light Optical Microscope

Light Optical Microscope

© E308-01

3D – Printer

3D – Printer

© E308-01

Microstructure and Chemistry

In addition to these specific infrastructure of the Materials Science Division, details on microstructure and chemistry are obtained by scanning electron microscopy (SEM), energy and wavelength dispersive X-ray spectrometry (EDS and WDS), and X-ray diffraction. Some of the needed instruments are available at the Institute directly (such as the Zeiss Sigma 500 VP SEM, to which the TEXS HP (Transition Element X-ray Spectrometer – High Precision) WDS system is attached as well as the in-situ SEM Femto-Nanoindenter). Further details are obtained with the help of the Core Shared Research Facilities of TU Wien, such as the Analytical Instrumentation Center (AIC), University Service Facility for Transmission Electron Microscopy (USTEM), and X-ray Center (XRC).