UHV DC/RF magnetron sputtering with 3 confocal cathodes (1x3'', 2x2''), substrate heating up to 700 °C, and Ar, N₂, O₂ gases.

DC/RF magnetron sputtering, one 3" cathode, substrate heating to 650 °C, Ar, N₂, and O₂ gases.

HiPIMS system, 4 confocal cathodes (2x3'', 2x6''), substrate heating to 600 °C, Ar, N₂, and O₂ gases.

HiPIMS system, one 3" cathode, substrate heating to 650 °C, Ar, N₂, O₂, and C₂H₂ gases.

CAE system, one 6" cathode (with skimmershield), Ar, N₂, and O₂ (optional C₂H₂) gases.

Industrial machine with 6 arc and 4 sputter sources, temperatures up to 600 °C, various gases.

Netzsch STA 449 F1 Jupiter, combining DSC and TGA, with 2 ovens (1600 °C and 2400 °C (vacuum)).

Wafer curvature measurement kSA MOS (Multi-beam Optical Sensor) ThermalScan Systems (MOS-TS300-HAT; linear scan up to 300 mm, RT–1000 °C, 10 K/s, passive cooling, vacuum). 

Centorr LF22-2000 vacuum furnace, Mo-shielding, max. 1600 °C, Ar, N₂, vacuum, heating rate 50 K/min, passive cooling.

CSIRO UMIS with Berkovich or Cube corner, dual force range 0–50 mN, 0–500 mN, dual displacement range 0–2 µm, 0–20 µm.

Nanoindenter with continuous stiffness measurement, 0.5 nN–200 mN, position 50 pm–20 µm (fine) or 40 mm (coarse), 130x130 mm 6 sample stage, high-speed mapping, fatigue testing.

Nanomechanical testing in SEM, force 0.5 nN–200 mN, position 50 pm–21 mm, compression/tensile, dynamic fracture, nanoindentation and fatigue.

Disc holder 0.01–2000 rpm, sensor 20 N, weights 1, 2, 5, 10 N, liquid cup holder, heater to 900 °C sample temp. 

3D Non-Contact white light profiler, 50 mm translation, 18 mm/s, CCS Prima sensor with up to 2 kHz data acquisition.

Coating-thickness measurements of 0.3–30 µm (error of 1–5 %) via grinded calottes of diameter 0.1–2 mm using ball diameter 15–30 mm.