Research

Growth of Polycrystalline Films

How are the nucleation conditions and the final structure of polycrystalline coatings connected and is it possible to quantify these relations?
The images below show a simulation of grain growth in polycrystalline films.

Color picture - simulation of grain growth in polycrystalline films

© IFP

Condensation and Wetting

Are classic thermodynamic statements also valid for the condensation from the vapor phase?
The following images show the development of a wetting layer of Sn on an Al-surface in Ultra High Vacuum (UHV) despite the thermodynamic immiscibility of Al and Sn.

Development of a wetting layer of Sn on an Al-surface in Ultra High Vacuum (UHV) despite the thermodynamic immiscibility of Al and Sn

© IFP

Heterogenous Films

How can the phase-distribution in multi-component films be described?
The images show the development of a connected phase (green, "percolation phase") of the minority phase in a two-component film.

Development of a connected phase (green, "percolation phase") of the minority phase in a two-component film

© IFP

Plasma-treatment of Surfaces and Adhesion

How can surface properties be modified by plasma treatment?
The image series shows the on-going roughening of a Lead-Bronze surface by Ar-DC-plasma with increasing exposure time.

On-going roughening of a Lead-Bronze surface by Ar-DC-plasma with increasing exposure time

© IFP

Temperature-treatment and De-wetting

How does a coating deposited far from the thermodynamic equilibrium approach the equilibrium state?
The image series shows the de-wetting of a 300 nm thick Cu film from a Carbon substrate at approx. 1000 K. The mechanism of de-wetting is first recrystallization, then hole formation at the convergence point of different grain boundaries and, finally, complete decomposition into isolated droplets. The image on the right hand side shows a simulation of the droplet positions. The red lines emphasize characteristic droplet correlations.

De-wetting of a 300 nm thick Cu film from a Carbon substrate at approx. 1000 K

© IFP